•Ultra stable temperature compensating classe I ceramic
•Custom voltage, package size, capacitance value on request
•Tested in accordance to CECC 32100 and AEC-Q200
•CECC 30600 et NFC 83-131 compliant
•Available in stack or radial
•Wide range of termination
•All PME SMD available in non magnetic
ELECTRICAL CHARACTERISTICS :
at + 25°C unless otherwise specified
OPERATING TEMPERATURE :
- 55°C, + 125°C
TEMPERATURE COEFFICIENT :
± 30ppm
DISSIPATION FACTOR :
≤ 1.10-3 at 1Vrms and 1MHz for values ≤ 1000pF
≤ 1.10-3 at 1Vrms and 1KHz for values > 1000pF
INSULATION RESISTANCE (IR) :
25°C/Un 105 MOhm or 1000 Ohm-Farad whichever is less
125°C/Un 104 MOhm or 100 Ohm-Farad whichever is less
DIELECTRIC STRENGTH TEST :
Performed per method 103 of EIA 198-2-E
1.2Un for 5s with 50mA max charging current
|
0603 |
A |
101 |
J |
B |
X |
B |
- |
|
SIZE |
DIELECTRIC |
CAPACITANCE |
TOLERANCE |
VOLTAGE |
TERMINATION |
PACKAGING |
SPECIAL PARAMETERS |
|
0402 0504 0603 0805 1206 1210 1808 1812 1825 2220 2225 3033 3640 4040 5440 |
A = NPO |
Expressed in picofarads (pF). The first two digits are significant, the third digit give thenumber of noughts. Example : 102 = 1 000pF |
A = ±0,5% if > 10pF and ±0,05pF if < 10 pF B = ± 0.1pF C = ± 0,25pF |
X = 25V A = 50V U = 63V B = 100V C = 200V P = 250V E = 500V F = 630V G = 1000V |
X = Nickel Tin F = Palladium-Silver P = Polymer Tin (Flex) C = Copper Tin (Non magnetic) W = Nickel Gold H = Dipped SnPb I = Electrolytic SnPb |
B = Reel V = Bulk |
- BM = BME Dxx = Reliabilty spec Exx = Sorting spec |
Cross References
