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Solutions for Passive, Thermal and Protection      Short lead times     French distributor

SMD Low Voltage Class I


10V - 1000V

Applications

•Typical uses : timing, precision circuitry, filtering


Features

•Ultra stable temperature compensating classe I ceramic
•Custom voltage, package size, capacitance value on request
•Tested in accordance to CECC 32100 and AEC-Q200
•CECC 30600 et NFC 83-131 compliant
•Available in stack or radial
•Wide range of termination
•All PME SMD available in non magnetic

Electrical Parameters

ELECTRICAL CHARACTERISTICS :
at + 25°C unless otherwise specified
OPERATING TEMPERATURE :
- 55°C, + 125°C
TEMPERATURE COEFFICIENT :
± 30ppm 
DISSIPATION FACTOR :
≤ 1.10-3 at 1Vrms and 1MHz for values ≤ 1000pF
≤ 1.10-3 at 1Vrms and 1KHz for values > 1000pF
INSULATION RESISTANCE (IR) :
25°C/Un 105 MOhm or 1000 Ohm-Farad whichever is less
125°C/Un 104 MOhm or 100 Ohm-Farad whichever is less
DIELECTRIC STRENGTH TEST :
Performed per method 103 of EIA 198-2-E
1.2Un for 5s with 50mA max charging current

Ordering Information

0603

A

101

J

B

X

B

-

SIZE

DIELECTRIC

CAPACITANCE

TOLERANCE

VOLTAGE

TERMINATION

PACKAGING

SPECIAL PARAMETERS

0402

0504

0603

0805

1206

1210

1808

1812

1825

2220

2225

3033

3640

4040

5440

A = NPO

Expressed in

picofarads (pF).

The first two digits

are significant, the

third digit give thenumber of noughts.

Example :

102 = 1 000pF

A = ±0,5% if > 10pF and ±0,05pF if < 10 pF

B = ± 0.1pF

C = ± 0,25pF
D = ± 0,5pF
E = 0,1%
F = ± 1%
G = ± 2%
J = ± 5%
K = ± 10%

X = 25V

A = 50V

U = 63V

B = 100V

C = 200V

P = 250V

E = 500V

F = 630V

G = 1000V

X = Nickel Tin

F = Palladium-Silver

P = Polymer Tin (Flex)

C = Copper Tin (Non magnetic)

W = Nickel Gold

H = Dipped SnPb

I = Electrolytic SnPb
Q = Solderable Silver

B = Reel

V = Bulk

-

BM = BME

Dxx = Reliabilty spec

Exx = Sorting spec
D20 = AECQ200

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